Stabilization of nano-Al2O3p/Cu composite after high temperature annealing treatment

Al2O3 dispersion strengthened copper composite (Al2O3 Cu composite) was produced by internal oxidation. The hardness and electrical conductivity of the produced Al2O3 Cu composite (0.60 wt.% Al2O3) subjected to high temperature annealing treatments after different cold work deformations have been investigated; the microstructures of the composite have also been analyzed by TEM. Results show that the microstructure of the composite is characterized by an uniform distribution of nano-Al2O3 particles in Cu-matrix; the composite can maintain more than 91% hardness retention after 1h, 1000 degrees C annealing treatment; the recrystallization of the Cu-matrix can be largely retarded and only partially happened even annealing for 1h at 1050 degrees C, following cold deformation of 84%.