Advances in Low-Cost Phased Arrays Using Silicon Technologies

被引：0

作者：

Rebeiz, Gabriel M. ^{[1
]}

Paulsen, Lee M. ^{[2
]}

机构：

[1] Univ Calif San Diego, La Jolla, CA 92093 USA

[2] Rockwell Collins, 400 Collins Rd NE, Cedar Rapids, IA 52498 USA

来源：

2017 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION & USNC/URSI NATIONAL RADIO SCIENCE MEETING | 2017年

关键词：

Phased arrays; mobile communication; SiGe; core chips; X-BAND;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents phased-array efforts at X to Ka-band based on highly-integrated silicon core chips. The work shows that it is possible to build advanced phased-arrays using SiGe chips at each antenna element. The phased-array is constructed on a single printed-circuit board which reduces the cost by a factor of 10x. This will revolutionize X, Ku and Ka-band phased arrays by making them the preferred choice for 5G, SATCOM and point-to-point applications.

引用

页码：1035 / 1036

页数：2

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