Exploring temperature-controlled friction stir powder additive manufacturing process for multi-layer deposition of aluminum alloys

被引:29
作者
Chaudhary, Bhavesh [1 ]
Jain, Neelesh Kumar [1 ]
Murugesan, Jayaprakash [2 ]
Patel, Vivek [3 ]
机构
[1] IIT Indore, Dept Mech Engn, Simrol 453552, MP, India
[2] IIT Indore, Dept Met Engn & Mat Sci, Simrol 453552, MP, India
[3] Univ West, Dept Engn Sci, S-46186 Trollhattan, Sweden
来源
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T | 2022年 / 20卷
关键词
Friction stir; Additive manufacturing; Aerospace grade Al alloys; Close loop; Temperature-controlled; MICROSTRUCTURE; COMPOSITES; EVOLUTION; DESIGN; AL;
D O I
10.1016/j.jmrt.2022.07.049
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents preliminary study on multi-layer deposition of aerospace grade Al 6061 alloy by novel friction stir powder additive manufacturing process. Minimum temperature of deposition was in-situ maintained using close loop temperature-controlled system for minimizing thermal gradient in the build direction. Maximum temperature during the deposition was monitored in-situ using pyrometer and thermal imaging camera. Use of a tool with circumferential and radial grooves and continuous external heating facilitated smooth three-layer deposition of Al 6061 alloy with 60% deposition efficiency and 417 degrees C as maximum deposition temperature. Larger value of temperature at deposition zone improved material flowability and deposition quality. Microstructure of multi-layer deposition found to consist of fine sub-grains. Element analysis showed uniform distribution of major alloying elements in it. Phase analysis revealed Al along with Mg2Si hardening precipitates. Tensile strength and microhardness were close to the commercially available wrought AA6061-T4 alloy. It showed ductility with 16% elongation. The presented process is a viable alternative to fusion-based additive manufacturing processes for multi-layer depositions of aerospace grade and other lightweight alloys which are difficult-to-additively-manufacture. (C) 2022 The Author(s). Published by Elsevier B.V.
引用
收藏
页码:260 / 268
页数:9
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