共 50 条
[41]
Modeling of GaN based resonant-cavity light-emitting diode
[J].
LIGHT-EMITTING DIODES: RESEARCH, MANUFACTURING, AND APPLICATIONS XI,
2007, 6486
[43]
Light-emitting diode based on ZnO and GaN direct wafer bonding
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS,
2006, 45 (37-41)
:L1045-L1047
[44]
Evaluation of green light Emitting diode with p-type GaN interlayer
[J].
KOREAN CHEMICAL ENGINEERING RESEARCH,
2016, 54 (02)
:274-277
[45]
The Thermal Resistance of Solder Joints in High Brightness Light Emitting Diode (HB LED) Packages
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2009, 32 (04)
:825-831
[46]
Charging method of micro heat pipe for high-power light-emitting diode
[J].
MICRO & NANO LETTERS,
2015, 10 (10)
:518-522
[47]
Thermal Transient Characteristics of Flip Chip High Power Light Emitting Diodes
[J].
TENTH INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING,
2010, 7784