Investigation of Variation Power and Additive Gas Effect on the SF6 Destruction Using Atmospheric Microwave Plasma Torch

An atmospheric microwave plasma torch for the decomposition of SF6 accompanying additive gases (O-2, compressed air) was investigated experimentally in this paper. Applied microwave power and additive gas species as effective parameters on destruction and removal efficiency (DRE) were considered. It was approved that compressed air is a more efficient additive gas for the removal of SF6 compared to oxygen. Also, DRE is highly dependent on the variation of forward power. Highest efficiencies while using oxygen and compressed air as additive gases have been 98.4% and 99.1% (in 1100 W), respectively. In some case, the N-2 was also used with SF6, resulting in a maximum efficiency (in 1100 W) of 99.4%. This paper approves that a microwave plasma torch sustained in atmospheric pressure can almost completely remove the SF6 in semiconductor industry.