Micro-diamond assisted bidirectional tuning of thermal conductivity in multifunctional graphene nanoplatelets/nanofibrillated cellulose films

被引:42
|
作者
Zhang, Yinhang [1 ,2 ]
Wang, Wei [1 ]
Zhang, Fei [1 ,2 ]
Huang, Lingqi [1 ,2 ]
Dai, Kun [1 ]
Li, Chuanbing [1 ]
Liu, Dan [1 ,2 ]
Sun, Yuxuan [1 ]
Ren, Danhui [1 ]
Wu, Jinyi [1 ]
Zheng, Qingbin [1 ]
机构
[1] Chinese Univ Hong Kong, Sch Sci & Engn, Shenzhen 518172, Guangdong, Peoples R China
[2] Univ Sci & Technol China, Dept Mat Sci & Engn, Hefei 230026, Anhui, Peoples R China
基金
中国国家自然科学基金; 中国博士后科学基金;
关键词
Thermal interface materials; Thermal conductivity; Graphene; Joule heating; COMPOSITES; NANOCOMPOSITES; NANODIAMOND; FABRICATION; MANAGEMENT; INTERFACE; ROBUST;
D O I
10.1016/j.carbon.2021.12.067
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Environmentally friendly thermal interface materials (TIMs) with bidirectional high thermal conductivities have aroused considerable interests for addressing the heat dissipation issue in integrated circuits. Although graphene-based TIMs exhibit excellent in-plane thermal conductive performance, their through-plane thermal conductivity is commonly less than 3 Wm(-1)K(-1) owing to the vast interfacial phonon scattering, significantly limiting their practical applications. In this study, a strategy aimed at building TIMs with controllable heat transfer pathways both along the in-plane and through-plane directions is proposed by incorporating micron-diamonds (MDs) in graphene nanoplatelets/nanofibrillated cellulose (GNPs/NFC) composite film via a facile and green self-assembly method. The morphology of the obtained MDs@GNPs/NFC composite film can be precisely tailored from a hierarchical structure to a 3D solid foam-like structure to tailor heat transfer paths. By adjusting the loading and particle size of MDs, a through-plane thermal conductivity of 8.85 Wm(-1)K(-1) was achieved accompanied with a simultaneously high in-plane thermal conductivity of 32.01 Wm(-1)K(-1). The excellent bidirectional thermal conductive performance is integrated with high-efficiency Joule heating capability, outstanding nonflammability, as well as superior electromagnetic shielding performance, showing a promising future in advanced electronic devices. (C) 2021 Elsevier Ltd. All rights reserved.
引用
收藏
页码:265 / 275
页数:11
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