Drift-free, 50 A, 10 kV 4H-SiC PiN diodes with improved device yields

被引:45
|
作者
Das, MK [1 ]
Sumakeris, JJ [1 ]
Hull, BA [1 ]
Richmond, J [1 ]
Krishnaswami, S [1 ]
Powell, AR [1 ]
机构
[1] Cree Inc, Durham, NC 27703 USA
来源
SILICON CARBIDE AND RELATED MATERIALS 2004 | 2005年 / 483卷
关键词
PiN diode; high voltage; V-f drift; BPD; device yield;
D O I
10.4028/www.scientific.net/MSF.483-485.965
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The path to commericializing a 4H-SiC power PiN diode has faced many difficult challenges. In this work, we report a 50 A, 10 W 4H-SiC PiN diode technology where good crystalline quality and high carrier lifetime of the material has enabled a high yielding process with V-F as low as 3.9 V @ 100 A/cm(2). Furthermore, incorporation of two independent basal plane dislocation reduction processes (LBPD 1 and LBPD 2) have produced a large number of devices that exhibit a high degree of forward voltage stability with encouraging reverse blocking capability. This results in a total yield (forward, 10 W blocking, and drift) of > 20% for 8.7 mm x 8.7 mm power PiN diode chips-the largest SiC chip reported to date.
引用
收藏
页码:965 / 968
页数:4
相关论文
共 50 条
  • [41] Comparison of 4H-SiC pn, pinch and Schottky diodes for the 3 kV range
    Peters, D
    Friedrichs, P
    Schörner, R
    Stephani, D
    SILICON CARBIDE AND RELATED MATERIALS 2001, PTS 1 AND 2, PROCEEDINGS, 2002, 389-3 : 1125 - 1128
  • [42] VF Degradation of 4H-SiC PiN Diodes Using Low-BPD Wafers
    Ota, C.
    Nishio, J.
    Takao, K.
    Shinohe, T.
    SILICON CARBIDE AND RELATED MATERIALS 2013, PTS 1 AND 2, 2014, 778-780 : 851 - 854
  • [43] High-Voltage 4H-SiC PiN Diodes With Etched Junction Termination Extension
    Ghandi, Reza
    Buono, Benedetto
    Domeij, Martin
    Malm, Gunnar
    Zetterling, Carl-Mikael
    Ostling, Mikael
    IEEE ELECTRON DEVICE LETTERS, 2009, 30 (11) : 1170 - 1172
  • [44] Analysis of Electrical Characteristics due to Deep Level Defects in 4H-SiC PiN Diodes
    Lee, Tae-Hee
    Park, Se-Rim
    Kim, Ye-Jin
    Park, Seung-Hyun
    Kim, Il Ryong
    Kim, Min Kyu
    Lim, Byeong Cheol
    Koo, Sang-Mo
    KOREAN JOURNAL OF MATERIALS RESEARCH, 2024, 34 (02): : 111 - 115
  • [45] A novel 3.3 kV 4H-SiC trench PiN with enhanced conductance modulation effect
    Zhangl, Yourun
    Ou, Yanggang
    Luo, Jiamin
    Wang, Shuai
    Zhang, Bo
    Niu, Yingxi
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2022, 37 (07)
  • [46] Simulation of TEDREC Phenomena for 4H-SiC Pin Diode with p/n Type Drift Layer
    Nakayama, Koji
    Hemmi, Tetsuro
    Asano, Katsunori
    SILICON CARBIDE AND RELATED MATERIALS 2012, 2013, 740-742 : 1107 - 1110
  • [47] Investigation of the Internal Carrier Distribution in 4H-SiC pin-Diodes by Laser Absorption Experiments
    Werber, D.
    Aigner, M.
    Denoth, D.
    Wittmann, F.
    Wachutka, G.
    SILICON CARBIDE AND RELATED MATERIALS 2007, PTS 1 AND 2, 2009, 600-603 : 493 - +
  • [48] High-voltage 4H-SiC PiN diodes with the etched implant junction termination extension
    Juntao Li
    Chengquan Xiao
    Xingliang Xu
    Gang Dai
    Lin Zhang
    Yang Zhou
    An Xiang
    Yingkun Yang
    Jian Zhang
    Journal of Semiconductors, 2017, 38 (02) : 51 - 54
  • [49] A 10kV 4H-SiC PiN Diode with Gradual Doping Buffer Layers and p plus Adjusting Regions at Cathode
    Wang, Cailin
    Su, Le
    Zhang, Lei
    2018 1ST WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA), 2018, : 221 - 224
  • [50] 27.5 kV 4H-SiC PiN Diode with Space-Modulated JTE and Carrier Injection Control
    Nakayama, Koji
    Mizushima, Tomonori
    Takenaka, Kensuke
    Koyama, Akihiro
    Kiuchi, Yuji
    Matsunaga, Shinichiro
    Fujisawa, Hiroyuki
    Hatakeyama, Tetsuo
    Takei, Manabu
    Yonezawa, Yoshiyuki
    Kimoto, Tsunenobu
    Okumura, Hajime
    PRODCEEDINGS OF THE 2018 IEEE 30TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2018, : 395 - 398