Rapid thermal modeling for smart-power and integrated multichip power circuit design.

被引：3
|
作者：
Dupuy, P [1 ]
Dorkel, JM [1 ]
Tounsi, P [1 ]
Borucki, L [1 ]
机构：
[1] CNRS,LAB ANAL & ARCHITECTURE SYST,F-31077 TOULOUSE,FRANCE
来源：
ISPSD '96 - 8TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS, PROCEEDINGS | 1996年
关键词：
D O I：
10.1109/ISPSD.1996.509474
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：173 / 176
页数：4
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