共 31 条
- [1] Bassani G, 2015, IEEE ENG MED BIO, P5070, DOI 10.1109/EMBC.2015.7319531
- [2] Bryant R.G., 2007, Overview of NASA Langley's piezoelectric ceramic packaging technology and applications
- [3] C. M. University, CMU GRAPH LAB MOT CA
- [4] De Pasquale G., 2013, Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on, P1
- [6] Gyselinckx B, 2006, IFIP VLSI-SOC 2006: IFIP WG 10.5 INTERNATIONAL CONFERENCE ON VERY LARGE SCALE INTEGRATION & SYSTEM-ON-CHIP, P175
- [7] Haghi M, 2017, HEALTHC INFORM RES, V23, P4
- [8] Huang L., 2009, JDCTA, V3, P136, DOI DOI 10.4156/JDCTA.VOL3.ISSUE3.18