Experimental modal analysis of PBGA printed circuit board assemblies

被引：14

作者：

Yang, QJ ^{[1
]}

Lim, GH ^{[1
]}

Lin, RM ^{[1
]}

Yap, FF ^{[1
]}

Pang, HLJ ^{[1
]}

Wang, ZP ^{[1
]}

机构：

[1] Nanyang Technol Univ, Gint Inst Mfg Technol, Singapore 638075, Singapore

来源：

PROCEEDINGS OF THE 1997 1ST ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE | 1997年

关键词：

D O I：

10.1109/EPTC.1997.723924

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

In order to understand the dynamic properties and develop a valid finite element model of a Plastic Ball Grid Array (PBGA) PCB assembly, a series of experimental modal tests have been conducted and reported in this paper. Firstly, the purpose and importance of conducting these experimental modal tests are discussed. Secondly, detailed test results of our PBGA PCB assembly are presented, which can serve as a valuable reference for those who are interested in the vibration fatigue reliability of PBGA PCB assemblies. Lastly, some factors which have important influences on the modal test results of the PCB assembly are discussed.

引用

页码：290 / 296

页数：7