Optical properties of copper helical nanostructures: the effect of thickness on the SPR peak position

被引:3
作者
Potocnik, J. [1 ]
Bozinovic, N. [1 ]
Novakovic, M. [1 ]
Barudzija, T. [1 ]
Nenadovic, M. [1 ]
Popovic, M. [1 ]
机构
[1] Univ Belgrade, Vinca Inst Nucl Sci Natl Inst Republ Serbia, Belgrade, Serbia
关键词
copper; glancing angle deposition; helical nanostructures; ellipsometry; optical properties; surface plasmon resonance; THIN-FILMS; NANOPARTICLES; SIZE; CU; MICROSTRUCTURE; FABRICATION; DEPOSITION; OXIDATION; TEXTURE; SILICON;
D O I
10.1088/1361-6528/ac705c
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this study, we have investigated the effect of thickness on the structural and optical properties of copper (Cu) helical nanostructures. Thin films with thicknesses of 160 nm, 280 nm, 450 nm, and 780 nm were obtained by e-beam glancing angle deposition. The morphology and the microstructure were studied by field emission scanning electron microscopy, x-ray diffraction and transmission electron microscopy, while for the optical analysis measurements spectroscopic ellipsometry was used. The results show that the deposited structures are porous with nanometer-sized crystallites preferentially oriented along (111) planes, as well as that the diameter of the helices increases with thickness. Detailed analyses of optical properties have demonstrated that the dielectric function of Cu structures is greatly influenced by the films thicknesses. With increasing thickness from 160 nm to 780 nm, the surface plasmon resonance peak was shifted from 1.31 eV to 1.05 eV, which was correlated with the growth mechanism and the size of deposited nanostructures.
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页数:11
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共 64 条
[1]   Electroless copper deposition on silicon with titanium seed layer [J].
Aithal, Rajendra K. ;
Yenamandra, S. ;
Gunasekaran, R. A. ;
Coane, P. ;
Varahramyan, K. .
MATERIALS CHEMISTRY AND PHYSICS, 2006, 98 (01) :95-102
[2]  
Al-Haddad RMS., 2014, INT J ENG RES APPL, V4, P89
[3]   CO oxidation catalyzed by single-walled helical gold nanotube [J].
An, Wei ;
Pei, Yong ;
Zeng, X. C. .
NANO LETTERS, 2008, 8 (01) :195-202
[4]   Topography simulation for the virtual wafer fab [J].
Cale, TS ;
Merchant, TP ;
Borucki, LJ ;
Labun, AH .
THIN SOLID FILMS, 2000, 365 (02) :152-175
[5]   Fundamental parameters line profile fitting in laboratory diffractometers [J].
Cheary, RW ;
Coelho, AA ;
Cline, JP .
JOURNAL OF RESEARCH OF THE NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, 2004, 109 (01) :1-25
[6]   Mechanical properties of nanosprings [J].
da Fonseca, AF ;
Galvao, DS .
PHYSICAL REVIEW LETTERS, 2004, 92 (17) :175502-1
[7]   Microstructure and physical properties of nanostructured tin oxide thin films grown by means of pulsed laser deposition [J].
Dolbec, R ;
El Khakani, MA ;
Serventi, AM ;
Trudeau, M ;
Saint-Jacques, RG .
THIN SOLID FILMS, 2002, 419 (1-2) :230-236
[8]   OPTICAL PROPERTIES OF THIN METALLIC FILMS IN ISLAND FORM [J].
DOREMUS, RH .
JOURNAL OF APPLIED PHYSICS, 1966, 37 (07) :2775-&
[9]   Effect of sol concentration on the properties of ZnO thin films prepared by sol-gel technique [J].
Dutta, M. ;
Mridha, S. ;
Basak, D. .
APPLIED SURFACE SCIENCE, 2008, 254 (09) :2743-2747
[10]   VLSI ON-CHIP INTERCONNECTION PERFORMANCE SIMULATIONS AND MEASUREMENTS [J].
EDELSTEIN, DC ;
SAIHALASZ, GA ;
MII, YJ .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1995, 39 (04) :383-401