A full-wave characterization of PCB having various ground plane shapes

被引：0
|
作者：
Drissi, M [1 ]
Elkandoussi, M [1 ]
Kergonou, G [1 ]
Zak, T [1 ]
Xavier, C [1 ]
机构：
[1] INSA, CNRS, URER, Rennes, France
来源：
2001 IEEE EMC INTERNATIONAL SYMPOSIUM, VOLS 1 AND 2 | 2001年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An integral equation technique solved by the method of moment (MoM) is proposed to characterize planar interconnection lines printed on a dielectric substrate backed by a finite size arbitrarily ground plane shape. The ground plane topology effect on the current return is firstly highlighted thanks to the calculated current distribution. The effect of the finite size of the ground plane is then analyzed and evaluated on the propagation characteristics. The theoretical results of the radiated field are then compared with measurements where a good agreement is observed.
引用
收藏
页码：1213 / 1216
页数：4
相关论文
共 50 条
  • [41] Efficient full-wave characterization of arrays of antennas embedded in finite dielectric volumes
    Craeye, Christophe
    Gilles, Thierry
    Dardenne, Xavier
    RADIO SCIENCE, 2009, 44
  • [42] Systematic Full-Wave Characterization of Real-Metal Nano Dipole Antennas
    Ma, Zhongkun
    Vandenbosch, Guy A. E.
    IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2013, 61 (10) : 4990 - 4999
  • [43] Full-wave characterization of a through hole via in multi-layered packaging
    Natl Taiwan Univ, Taipei, Taiwan
    IEEE Trans Microwave Theory Tech, 5 (1073-1081):
  • [44] A new CAD model for the full-wave characterization of microstrip line and its discontinuities
    Mayouf, A
    Djahli, F
    INTERNATIONAL JOURNAL OF ELECTRONICS, 2000, 87 (11) : 1359 - 1383
  • [45] Full-Wave Characterization of High-T-c Superconducting Transmission Lines
    Lee, Laurence H.
    Ali, Sami M.
    Lyons, W. Gregory
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 1992, 2 (02) : 49 - 57
  • [46] Efficient modeling of PCB transients via a full-wave 3-D frequency domain integral equation
    Tham, C.Y.
    McCowen, A.
    Towers, M.S.
    IEEE Transactions on Magnetics, 2001, 37 (5 I) : 3676 - 3679
  • [47] Efficient modeling of PCB transients via a full-wave 3-D frequency domain integral equation
    Tham, CY
    McCowen, A
    Towers, MS
    IEEE TRANSACTIONS ON MAGNETICS, 2001, 37 (05) : 3676 - 3679
  • [48] 3D Full-Wave Simulation of Stub Length Effect of Vias in High Speed PCB Design
    Steenbergen, Eric
    Moonen, Niek
    Leferink, Frank
    PROCEEDINGS OF THE 2021 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC 2021), 2021,
  • [49] A Full-Wave PEEC Model for Thin-Wire Structure in the Air and Homogeneous Lossy Ground
    Ye, Weiping
    Liu, Weidong
    Xiang, Nianwen
    Li, Kejie
    Chen, Weijiang
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2023, 65 (02) : 518 - 527
  • [50] Harmonic Impedance of Grounding Electrodes Buried in a Horizontally Stratified Multilayer Ground: A Full-Wave Approach
    Karami, Hamidreza
    Sheshyekani, Keyhan
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2018, 60 (04) : 899 - 906
12345