Comprehensive Variability Analysis in Dual-Port FeFET for Reliable Multi-Level-Cell Storage

被引:22
作者
Chatterjee, Swetaki [1 ,2 ]
Thomann, Simon [1 ]
Ni, Kai [3 ]
Chauhan, Yogesh Singh [2 ]
Amrouch, Hussam [1 ]
机构
[1] Univ Stuttgart, Chair Semicond Test & Reliablil STAR, D-70569 Stuttgart, Germany
[2] Indian Inst Technol Kanpur, Dept Elect Engn, Kanpur 208016, Uttar Pradesh, India
[3] Rochester Inst Technol, Rochester, NY 14623 USA
关键词
FeFETs; Iron; Logic gates; Reliability; Hafnium oxide; Threshold voltage; Q measurement; Asymmetric double-gate FeFET; FeFET; ferroelectric; multi-level-cell (MLC); random dopant fluctuation (RDF); random polarization; reliability; TCAD; variability; work-function variation (WFV); WORK-FUNCTION VARIATION; THRESHOLD VOLTAGE; MOSFETS; MEMORY; IMPACT; FLUCTUATIONS;
D O I
10.1109/TED.2022.3192808
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
-based FeFET is a remarkably promising candidate among emerging memory technologies. Its manifold applications range from nonvolatile memory to neuromorphic computing. However, the memory window (MW) is limited, since the ferroelectric properties of degrade with increased ferroelectric thickness. Recent developments in asymmetric double-gate FeFET with dual port boast of a large MW when read from the back gate (BG), compared with the front gate (FG). It has been predicted that this can qualify as an excellent candidate for multi-level-cell (MLC) storage due to its high MW. However, the variability of the intermediate threshold voltage () states must be within reasonable limits to enable error-free reliable operation. In this work, we have thoroughly investigated the variability of states in dual-port FeFET due to the random spatial distribution of ferroelectric domains. We have also accounted for the conventional sources of device variations, such as random dopant fluctuation (RDF), metal work-function variation (WFV), and line edge roughness (LER). We show that as MW is amplified when reading from BG compared with FG, variability is also amplified, thereby restricting its usage to accommodate a higher number of states. Nevertheless, a key benefit of BG read stems from the ability to reduce the ferroelectric thickness () from 10 nm down to merely 3 nm, still retaining an MW of 2.7 V. Notably, reducing makes it possible to operate the FeFET at a lower voltage (1.8 V instead of 4 V). This creates avenues for better compatibility with the existing VLSI designs and reliability enhancements. We demonstrate that the variations in are reduced for BG read on reducing, which allows us to hold the same number of states even at such a scaled thickness. Finally, we predict the maximum number of states (in terms of bits) that can be stored and read reliably in dual-port FeFET for FG read and BG read at nominal and scaled . We demonstrate that dual-port FeFET with BG read and scaled offers MLC storage of 3 bits.
引用
收藏
页码:5316 / 5323
页数:8
相关论文
共 32 条
  • [1] ICCAD Tutorial Session Paper Ferroelectric FET Technology and Applications: From Devices to Systems
    Amrouch, Hussam
    Gao, Di
    Hu, Xiaobo Sharon
    Kazemi, Arman
    Laguna, Ann Franchesca
    Ni, Kai
    Niemier, Michael
    Sharifi, Mohammad Mehdi
    Thomann, Simon
    Yin, Xunzhao
    Zhuo, Cheng
    [J]. 2021 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER AIDED DESIGN (ICCAD), 2021,
  • [2] Random dopant induced threshold voltage lowering and fluctuations in sub-0.1 μm MOSFET's:: A 3-D "atomistic" simulation study
    Asenov, A
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1998, 45 (12) : 2505 - 2513
  • [3] Polysilicon gate enhancement of the random dopant induced threshold voltage fluctuations in sub-100 nm MOSFET's with ultrathin gate oxide
    Asenov, A
    Saini, S
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2000, 47 (04) : 805 - 812
  • [4] Compact FeFET Circuit Building Blocks for Fast and Efficient Nonvolatile Logic-in-Memory
    Breyer, Evelyn T.
    Mulaosmanovic, Halid
    Trommer, Jens
    Melde, Thomas
    Duenkel, Stefan
    Trentzsch, Martin
    Beyer, Sven
    Slesazeck, Stefan
    Mikolajick, Thomas
    [J]. IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2020, 8 : 748 - 756
  • [5] Variability Analysis for Ferroelectric Field-Effect Transistors
    Choe, Gihun
    Yu, Shimeng
    [J]. 2021 5TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE (EDTM), 2021,
  • [6] Choe G, 2020, INT CONF SIM SEMI PR, P165, DOI [10.23919/sispad49475.2020.9241618, 10.23919/SISPAD49475.2020.9241618]
  • [7] Investigation and Comparison of Work Function Variation for FinFET and UTB SOI Devices Using a Voronoi Approach
    Chou, Shao-Heng
    Fan, Ming-Long
    Su, Pin
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2013, 60 (04) : 1485 - 1489
  • [8] Impact of Random Spatial Fluctuation in Non-Uniform Crystalline Phases on the Device Variation of Ferroelectric FET
    Garg, Chirag
    Chauhan, Nitanshu
    Deng, Shan
    Khan, Asif Islam
    Dasgupta, Sudeb
    Bulusu, Anand
    Ni, Kai
    [J]. IEEE ELECTRON DEVICE LETTERS, 2021, 42 (08) : 1160 - 1163
  • [9] On the Reliability of FeFET On-Chip Memory
    Genssler, Paul R.
    van Santen, Victor M.
    Henkel, Joerg
    Amrouch, Hussam
    [J]. IEEE TRANSACTIONS ON COMPUTERS, 2022, 71 (04) : 947 - 958
  • [10] Jerry Matthew, 2017, 2017 IEEE International Electron Devices Meeting (IEDM), P621, DOI 10.1109/IEDM.2017.8268338