Integrated optoelectronic transmitter and receiver multi-chip modules for three-dimensional chip-level micro-optical interconnects

被引:2
作者
Lohokare, SK [1 ]
Prather, DW
Cox, JA
Sims, PE
Mauk, MG
Sulima, OV
机构
[1] Univ Delaware, Dept Elect & Comp Engn, Newark, DE 19716 USA
[2] Astropower Inc, Newark, DE 19716 USA
关键词
transmitter and receiver multichip module; optical interconnects; flip-chip bonding; diffractive optics; vertical-cavity surface-emitting lasers; GaAs; photodetector;
D O I
10.1117/1.1599839
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
We demonstrate a chip-scale micro-optical interconnect. The prototype system for this demonstration consists of optoelectronic transmitter and receiver multichip modules. A diffractive optical element (DOE) is used for optically interconnecting the multichip modules and in establishing a point-to-point link. The link length, as measured from the optical source of the transmitter to the detector plane of the receiver, is only 2.332 trim. The transmitter and receiver module dimensions as well as the integrated system volume are comparable to very large scale integration (VLSI). The design, fabrication, integration of this system, and experimental results are presented. (C) 2003 Society of Photo-Optical Instrumentation Engineers.
引用
收藏
页码:2683 / 2688
页数:6
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