Measurement of dynamic warpage during thermal cycling of dielectric coated SS substrates for large area MCM-D packaging

被引:5
作者
Dang, AXH
Ume, IC
Bhattacharya, SK
机构
[1] Georgia Inst Technol, Sch Mech Engn, Atlanta, GA 30332 USA
[2] Georgia Inst Technol, Packaging Res Ctr, Atlanta, GA 30332 USA
关键词
D O I
10.1115/1.483138
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Potential application of stainless steel (SS) as a base substrate material for a large area MCM-D packaging is reported in this paper. A test vehicle was fabricated using 0.008 in. thick and 12 in.X12 in. SS panel with laser drilled 0.01 in. vias. A dielectric material (Parylene N) was deposited on the SS panel and around the inside via walls in order to electrically isolate the via filling material from the body of the SS substrate and also making the SS surface non-conductive. Vias were filled using a commercially available conductive via-plug material. The test structure was exposed to elevated temperatures to simulate the thermal excursion the substrate would be subjected to during the MCM-D thin film process. The end objective of this work is to be able to fabricate large area (24 in. X24 in.) SS substrates for next generation MCM-D packaging with reduced warpage. This paper reports results of the dynamic warpage measurement during thermal cycling of a 12 in. X12 in. Parylene N coated SS substrate.
引用
收藏
页码:77 / 85
页数:9
相关论文
共 9 条
  • [1] DANG A, 1999, P ASME INTERPACK MAU, P1841
  • [2] A new anisotropic conductive film with arrayed conductive particles
    Ishibashi, K
    Kimura, J
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (04): : 752 - 757
  • [3] MICROELECTRONIC SKIN ELECTRODE
    PADMADINATA, FZ
    VEERHOEK, JJ
    VANDIJK, GJA
    HUIJSING, JH
    [J]. SENSORS AND ACTUATORS B-CHEMICAL, 1990, 1 (1-6) : 491 - 494
  • [4] Post D., 1994, High Sensitivity Moire: Experimental Analysis for Mechanics and Materials
  • [5] System for real-time measurement of thermally induced PWB/PWA warpage
    Stiteler, MR
    Ume, IC
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 1997, 119 (01) : 1 - 7
  • [6] In-process board warpage measurement in a lab scale wave soldering oven
    Stiteler, MR
    Ume, IC
    Leutz, B
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1996, 19 (04): : 562 - 569
  • [7] TUMMALA RR, 1997, MICROELECTRONIC PACK, pCH18
  • [8] WANG Y, 1998, EXPT NUMERICAL MECH, V2, P32
  • [9] WANG Y, 1998, INT J MICROCIRCUIT E, V21, P191