Role of Self-Heating and Polarization in AlGaN/GaN-Based Heterostructures

被引:15
作者
Ahmeda, Khaled [1 ]
Ubochi, Brendan [1 ]
Benbakhti, Brahim [2 ]
Duffy, Steven J. [2 ]
Soltani, Ali [3 ,4 ]
Zhang, Wei Dong [2 ]
Kalna, Karol [1 ]
机构
[1] Swansea Univ, Coll Elect & Elect Engn, Nanoelect Devices Computat Grp, Swansea SA2 8PP, W Glam, Wales
[2] Liverpool John Moores Univ, Dept Elect & Elect Engn, Liverpool L3 3AF, Merseyside, England
[3] Univ Sherbrooke, Lab Nanotechnol & Nanosyst, Sherbrooke, PQ J1K 0A5, Canada
[4] Univ Lille, Inst Elect Microelect & Nanotechnol, F-59650 Lille, France
来源
IEEE ACCESS | 2017年 / 5卷
关键词
III-V nitrides; self-heating; polarization; TLM structures; electro-thermal transport simulations; ELECTRON-MOBILITY TRANSISTORS; GAN; SEMICONDUCTOR; HEMTS; PERFORMANCE; TRANSPORT; DEFECTS; HFETS; FIELD;
D O I
10.1109/ACCESS.2017.2755984
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
The interplay of self-heating and polarization affecting resistance is studied in AlGaN/GaN transmission line model (TLM) heterostructures with a scaled source-to-drain distance. This paper is based on meticulously calibrated TCAD simulations against I-V experimental data using an electro-thermal model. The electro-thermal simulations show hot-spots (with peak temperature in a range of similar to 566 K-373 K) at the edge of the drain contact due to a large electric field. The electrical stress on Ohmic contacts reduces the total polarization, leading to the inverse/converse piezoelectric effect. This inverse effect decreases the polarization by 7%, 10%, and 17% during a scaling of the source-to-drain distance in the 12 mu m, 8 mu m, and 4 mu m TLM heterostructures, respectively, when compared with the largest 18-mu m heterostructure.
引用
收藏
页码:20946 / 20952
页数:7
相关论文
共 32 条
[1]  
[Anonymous], 2016, ATLAS US MAN DEV SIM
[2]   Density-dependent electron transport and precise modeling of GaN high electron mobility transistors [J].
Bajaj, Sanyam ;
Shoron, Omor F. ;
Park, Pil Sung ;
Krishnamoorthy, Sriram ;
Akyol, Fatih ;
Hung, Ting-Hsiang ;
Reza, Shahed ;
Chumbes, Eduardo M. ;
Khurgin, Jacob ;
Rajan, Siddharth .
APPLIED PHYSICS LETTERS, 2015, 107 (15)
[3]   Effects of Self-Heating on Performance Degradation in AlGaN/GaN-Based Devices [J].
Benbakhti, Brahim ;
Soltani, Ali ;
Kalna, Karol ;
Rousseau, Michel ;
De Jaeger, Jean-Claude .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2009, 56 (10) :2178-2185
[4]   CARRIER MOBILITIES IN SILICON EMPIRICALLY RELATED TO DOPING AND FIELD [J].
CAUGHEY, DM ;
THOMAS, RE .
PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, 1967, 55 (12) :2192-+
[5]   TEM observation of crack- and pit-shaped defects in electrically degraded GaNHEMTs [J].
Chowdhury, Uttiya ;
Jimenez, Jose L. ;
Lee, Cathy ;
Beam, Edward ;
Saunier, Paul ;
Balistreri, Tony ;
Park, Seong-Yong ;
Lee, Taehun ;
Wang, J. ;
Kim, Moon J. ;
Joh, Jungwoo ;
del Alamo, Jesus A. .
IEEE ELECTRON DEVICE LETTERS, 2008, 29 (10) :1098-1100
[6]  
Chu R., 2008, THESIS
[7]   AlGaN/GaN high electron mobility transistors on Si(111) substrates [J].
Chumbes, EM ;
Schremer, AT ;
Smart, JA ;
Yang, Y ;
MacDonald, NC ;
Hogue, D ;
Komiak, JJ ;
Lichwalla, SJ ;
Leoni, RE ;
Shealy, JR .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (03) :420-426
[8]   Wide band gap semiconductor reliability : Status and trends [J].
Delage, SL ;
Dua, C .
MICROELECTRONICS RELIABILITY, 2003, 43 (9-11) :1705-1712
[9]   Investigation of high-electric-field degradation effects in AlGaN/GaN HEMTs [J].
Faqir, Mustapha ;
Verzellesi, Giovanni ;
Meneghesso, Gaudenzio ;
Zanoni, Enrico ;
Fantini, Fausto .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (07) :1592-1602
[10]   Monte Carlo simulation of electron transport in the III-nitride wurtzite phase materials system: Binaries and ternaries [J].
Farahmand, M ;
Garetto, C ;
Bellotti, E ;
Brennan, KF ;
Goano, M ;
Ghillino, E ;
Ghione, G ;
Albrecht, JD ;
Ruden, PP .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (03) :535-542