Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review

被引:866
作者
Khan, Saleem [1 ,2 ]
Lorenzelli, Leandro [1 ,2 ]
Dahiya, Ravinder S. [3 ]
机构
[1] Univ Trent, I-38100 Trento, Italy
[2] Fdn Bruno Kessler, Microsyst Technol Res Unit, Ctr Mat & Microsyst, I-38122 Trento, Italy
[3] Univ Glasgow, Sch Engn, Elect & Nanoscale Engn Res Div, Glasgow G12 8QQ, Lanark, Scotland
基金
英国工程与自然科学研究理事会;
关键词
Printed sensors; printed electronics; flexible electronics; large area electronics; roll-to-roll; dispersion solution; THIN-FILM TRANSISTORS; ROLL-TO-ROLL; HIGH-RESOLUTION; NANOIMPRINT LITHOGRAPHY; SEMICONDUCTOR NANOWIRES; INTEGRATED-CIRCUITS; CARBON NANOTUBES; POLYMER INKS; FABRICATION; SILICON;
D O I
10.1109/JSEN.2014.2375203
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Printing sensors and electronics over flexible substrates are an area of significant interest due to low-cost fabrication and possibility of obtaining multifunctional electronics over large areas. Over the years, a number of printing technologies have been developed to pattern a wide range of electronic materials on diverse substrates. As further expansion of printed technologies is expected in future for sensors and electronics, it is opportune to review the common features, the complementarities, and the challenges associated with various printing technologies. This paper presents a comprehensive review of various printing technologies, commonly used substrates and electronic materials. Various solution/dry printing and contact/noncontact printing technologies have been assessed on the basis of technological, materials, and process-related developments in the field. Critical challenges in various printing techniques and potential research directions have been highlighted. Possibilities of merging various printing methodologies have been explored to extend the lab developed standalone systems to high-speed roll-to-roll production lines for system level integration.
引用
收藏
页码:3164 / 3185
页数:22
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