Contact angle and reactive wetting in the SnPb/Cu system

被引：15

作者：

Wedi, A. ^{[1
]}

Baither, D. ^{[1
]}

Schmitz, G. ^{[1
]}

机构：

[1] Univ Munster, Inst Mat Phys, D-48149 Munster, Germany

来源：

SCRIPTA MATERIALIA | 2011年 / 64卷 / 07期

关键词：

Reactive wetting; Surface energy; Soldering; Intermetallic compounds; SURFACE-TENSION; ALLOYS; CU;

D O I：

10.1016/j.scriptamat.2010.12.026

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Wetting with a low contact angle is a prerequisite for reliable solder connections. However, the contact angle is only an indirect measure of adhesion energy. To quantify this energy, we measured wetting angles of solder droplets as well as surface tension of SnPb solders under systematic variation of composition. From the data, the effective interface energy is evaluated. Although surface tension and wetting angle depend continuously on solder composition, the adhesion tension reveals distinguished plateaus which are related to different reaction products. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：689 / 692

页数：4

共 13 条

[1] The thermodynamics of the surfaces of solution [J].

Butler, JAV .

PROCEEDINGS OF THE ROYAL SOCIETY OF LONDON SERIES A-CONTAINING PAPERS OF A MATHEMATICAL AND PHYSICAL CHARACTER, 1932, 135 (827) :348-375

[2] Progress in understanding and modeling reactive wetting of metals on ceramics [J].

Eustathopoulos, Nicolas .

CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE, 2005, 9 (4-5) :152-160

[3] METASTABLE PHASE-EQUILIBRIA IN THE LEAD-TIN ALLOY SYSTEM .2. THERMODYNAMIC MODELING [J].

FECHT, HJ ;

ZHANG, MX ;

CHANG, YA ;

PEREPEZKO, JH .

METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1989, 20 (05) :795-803

[4] On the mechanism of the binary Cu/Sn solder reaction -: art. no. 053106 [J].

Görlich, J ;

Schmitz, G ;

Tu, KN .

APPLIED PHYSICS LETTERS, 2005, 86 (05) :1-3

[5]

GRUNER S, 2004, STRUKTUR OBERFLACHEN

[6] THE SURFACE-TENSION OF TIN LEAD ALLOYS IN CONTACT WITH FLUXES [J].

HOWIE, FH ;

HONDROS, ED .

JOURNAL OF MATERIALS SCIENCE, 1982, 17 (05) :1434-1440

[7]

KEENE BJ, 1993, INT MATER REV, V38, P157, DOI 10.1179/095066093790326285

[8] Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition [J].

Liu, CY ;

Tu, KN .

JOURNAL OF MATERIALS RESEARCH, 1998, 13 (01) :37-44

[9] DENSITIES OF PB-SN ALLOYS DURING SOLIDIFICATION [J].

POIRIER, DR .

METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1988, 19 (09) :2349-2354

[10]

Shim JH, 1996, Z METALLKD, V87, P205

← 1 2 →