Experimental studies on the use of a phase change material for cooling mobile phones

被引：112

作者：

Setoh, G. ^{[1
]}

Tan, F. L. ^{[1
]}

Fok, S. C. ^{[2
]}

机构：

[1] Nanyang Technol Univ, Sch Mech & Aerosp Engn, Singapore, Singapore

[2] Petr Inst Abu Dhabi, Dept Mech Engn, Abu Dhabi, U Arab Emirates

来源：

INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER | 2010年 / 37卷 / 09期

关键词：

Phase change material; Mobile devices; Thermal management; Cooling; Heat sink; Transient heating; TRANSIENT THERMAL MANAGEMENT; PCM;

D O I：

10.1016/j.icheatmasstransfer.2010.07.013

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This paper is to examine the cooling of mobile phones using a phase change material (PCM). Experimental prototypes of mobile phones were fabricated using aluminum heat sinks with different numbers of fins filled with n-eicosane. The devices were subjected to steady-state and transient charging and discharging at different power settings. It was found that increasing the power increased the PCM melting rate. The internal fins also helped to lower the maximum device temperature. These findings indicated that the use of PCM-based heat sinks were effective for the cooling of mobile phones under intermittent moderate usage conditions. (C) 2010 Elsevier Ltd. All rights reserved.

引用

页码：1403 / 1410

页数：8

共 7 条

[1] Transient thermal management of a handset using phase change material (PCM) [J].

Hodes, M ;

Weinstein, RD ;

Pence, SJ ;

Piccini, JM ;

Manzione, L ;

Chen, C .

JOURNAL OF ELECTRONIC PACKAGING, 2002, 124 (04) :419-426

[2] Studies on optimum distribution of fins in heat sinks filled with phase change materials [J].

Saha, S. K. ;

Srinivasan, K. ;

Dutta, P. .

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2008, 130 (03)

[3] Numerical investigation of a PCM-based heat sink with internal fins [J].

Shatikian, V ;

Ziskind, G ;

Letan, R .

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2005, 48 (17) :3689-3706

[4] Thermal management of mobile phone using phase change material [J].

Tan, F. L. ;

Fok, S. C. .

2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, :836-+

[5] Cooling of mobile electronic devices using phase change materials [J].

Tan, FL ;

Tso, CP .

APPLIED THERMAL ENGINEERING, 2004, 24 (2-3) :159-169

[6]

Verkasalo Hannu, 2008, Info, V10, P51, DOI 10.1108/14636690810874395

[7] Effect of orientation for phase change material (PCM)-based heat sinks for transient thermal management of electric components [J].

Wang, Xiang-Qi ;

Mujumdar, Arun S. ;

Yap, Christopher .

INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2007, 34 (07) :801-808

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