Ultradense Silicon Photonic Interface for Optical Interconnection

被引:5
|
作者
Liao, Peicheng [1 ]
Sakib, Meer [1 ]
Lou, Fei [1 ]
Park, Jongchul [2 ]
Wlodawski, Mitchell [2 ]
Kopp, Victor I. [2 ]
Neugroschl, Dan [2 ]
Liboiron-Ladouceur, Odile [1 ]
机构
[1] McGill Univ, Dept Elect & Comp Engn, Montreal, PQ H3A 0G4, Canada
[2] Chiral Photon Inc, Pine Brook, NJ 07058 USA
基金
加拿大自然科学与工程研究理事会;
关键词
Multicore fiber array; bandwidth density; vertical grating couplers; silicon photonics; photonic integrated circuits (PICs); optical interconnection; GRATING COUPLERS;
D O I
10.1109/LPT.2015.2390540
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A scalable ultradense silicon photonic interface with 61 compact vertical grating couplers on a pitch of 42.3 mu m is designed and fabricated to match a pitch reducing optical fiber array (PROFA) hexagonal channel pattern. Experimental results show that the designed grating couplers with a minimum insertion loss of 4.5 dB and a 3-dB bandwidth of 50 nm are obtained. The crosstalk between different channels is less than -50 dB and the maximum loss difference across the PROFA interface is similar to 0.7 dB. High-speed data transmission indicates that a bandwidth density as large as 27 Tb/s/mm(2) could be achieved within a footprint of 0.096 mm(2), demonstrating the potential of silicon photonics for broadband optical interconnection.
引用
收藏
页码:725 / 728
页数:4
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