Special Issue on Testing of Three-Dimensional Stacked Integrated Circuits

被引：0
|
作者：
Agrawal, Vishwani D. [1 ]
机构：
[1] Auburn Univ, Dept ECE, Auburn, AL 36849 USA
来源：
JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS | 2012年 / 28卷 / 01期
关键词：
D O I：
10.1007/s10836-012-5285-4
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：1 / 1
页数：1
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