Modeling and simulation of a large integrated circuit package

被引：3

作者：

Gjonaj, Erion ^{[1
]}

Perotoni, Marcelo B. ^{[2
]}

Weiland, Thomas ^{[1
]}

机构：

[1] TU Darmstadt, TEMF, D-64283 Darmstadt, Germany

[2] CST GmbH, D-64288 Darmstadt, Germany

来源：

IEEE TRANSACTIONS ON MAGNETICS | 2008年 / 44卷 / 06期

关键词：

finite-integration technique; full-wave simulation; integrated circuits; parallel computing; signal integrity;

D O I：

10.1109/TMAG.2007.916008

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The first full-wave signal integrity analysis of a complete computer chip package is presented. The simulations are based on the Finite Integration Technique in the time domain. The handling of the highly complex package geometry and of the huge amount of unknowns arising in the discretization is made possible by use of massive parallelization. The latter employs an optimally balanced partitioning technique. Simulation results including signal delay times and cross-talk couplings are given.

引用

页码：1414 / 1417

页数：4

共 7 条

[1]

Bisseling RH, 2005, ELECTRON T NUMER ANA, V21, P47

[2]

GOERING R, 2004, EE TIMES ONLINE

[3] Package macromodeling via time-domain vector fitting [J].