MICRO-ASSEMBLY OF THREE DIMENSIONAL TETRAHEDRA BY CAPILLARY FORCES

被引:0
|
作者
van Honschoten, J. W. [1 ]
Legrain, A.
Berenschot, J. W. [1 ]
Abelmann, L. [1 ]
Tas, N. R. [1 ]
机构
[1] Univ Twente, Enschede, Netherlands
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents the realization of micrometer sized silicon nitride tetrahedra with well-defined angles that are folded out of a planar geometry using capillary forces. The required specific three-dimensional shape is achieved by a well-defined folding sequence. Using the favorable properties of the recently developed corner lithography technique, a programmable stop hinge is micro-machined by etching specifically defined intersection planes of the silicon mold. Tetrahedra were successfully folded by capillarity validating this new technique. The demand for such a microstructure has become very large since it can form the essential basic element for future three-dimensional data storage systems.
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页码:288 / 291
页数:4
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