Non-destructive thickness characterization of Si based heterostructure by X-ray diffraction and reflectivity

被引:2
|
作者
Liu, Xue-Chao [1 ]
Myronov, M. [1 ]
Dobbie, A. [1 ]
Nguyen, Van H. [1 ]
Leadley, D. R. [1 ]
机构
[1] Univ Warwick, Dept Phys, Nanosilicon Grp, Coventry CV4 7AL, W Midlands, England
基金
英国工程与自然科学研究理事会;
关键词
High-resolution X-ray diffraction; X-ray reflectivity; Thickness; Si based heterostructure; THIN-FILMS; SCATTERING;
D O I
10.1016/j.sse.2011.01.036
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
High-resolution X-ray diffraction rocking curve (RC) and X-ray reflectivity (XRR) were used to characterize the Si based heterostructures grown by reduced pressure chemical vapour deposition. The investigation focused on the reliability and accuracy of thickness measurement by the different techniques. For smooth Si epilayers grown on a thin (20 nm) strained Si(0.9)Ge(0.1) buffer, it is found that both XRR and RC produce reliable values that agree well with transmission electron microscope (TEM) results over a wide range. The best-fit thickness from both XRR and RC is within +/- 5% of the TEM measurement, with XRR producing more accurate values than RC. However, the agreement is not good for Si epilayer grown on a thick (2 mu m) relaxed Si(07)Ge(0.3) virtual substrate due to the presence of rough surface. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码:42 / 45
页数:4
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