Electrodeposition of high performance multilayer coatings of Zn-Co using triangular current pulses

被引:9
作者
Yogesha, S. [1 ]
Hegde, A. C. [1 ]
机构
[1] Natl Inst Technol Karnataka, Dept Chem, Electrochem Res Lab, Mangalore 575025, India
来源
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING | 2010年 / 88卷 / 06期
关键词
Compositionally modulated multilayer alloy; Zn-Co; Triangular pulse current; Corrosion resistance; SEM; CORROSION BEHAVIOR; ALLOY ELECTRODEPOSITION; ANODIC BEHAVIOR; SINGLE; ZINC; NICKEL; FILMS;
D O I
10.1179/174591910X12810116135068
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Compositionally modulated alloy (CMA) coatings of Zn-Co were electrodeposited on to mild steel from an acid chloride bath containing thiamine hydrochloride, as an additive. Electroplating was carried out galvanostatically from a single bath containing Zn2+ and Co2+ ions. Gradual change in composition in each layer was effected by triangular current pulses, cycling between two cathode current densities. Compositionally modulated alloy coatings were developed under different conditions of cyclic cathode current density and number of layers, and their corrosion resistances were evaluated by potentiodynamic polarisation and electrochemical impedance spectroscopy. The formation of multilayer and corrosion mechanism was analysed using scanning electron microscopy. The corrosion resistances of CMA and monolithic alloy coatings were compared with that of the base metal. Compositionally modulated alloy coating at optimal configuration, represented as (Zn-Co)(2.0/4.0/300), was found to exhibit similar to 80 times better corrosion resistance compared with monolithic (Zn-Co)(3.0) alloy, deposited for the same length of time from the same bath. Improved corrosion resistance was attributed to the formation of n-type semiconductor film at the interface, supported by Mott-Schottky plots. Decrease in corrosion resistance at high degree of layering was found, and is due to lower relaxation time for redistribution of solutes in the diffusion double layer, during plating.
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页码:317 / 323
页数:7
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