Transient Frequency-Domain Thermal Measurements With Applications to Electronic Packaging

被引：16

作者：

Yang, Yizhang ^{[1
]}

Master, Raj ^{[3
]}

Refai-Ahmed, Gamal ^{[2
]}

Touzelbaev, Maxat ^{[1
]}

机构：

[1] Adv Micro Devices Inc, Sunnyvale, CA 94085 USA

[2] Adv Micro Devices Inc, Markham, ON L36 7X6, Canada

[3] Microsoft Corp, Mountain View, CA 94043 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2012年 / 2卷 / 03期

关键词：

Frequency-domain response; thermal impedance; thermal interface materials; transient thermal characterization; IDENTIFICATION; DECONVOLUTION; RESISTANCES;

D O I：

10.1109/TCPMT.2010.2100712

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Non-uniform power distribution, increased die-size, and multiple-chip modules present new challenges for the thermal management of modern integrated circuit (IC) packages. Thermal characterization techniques capable of resolving partial thermal resistances at the component level have received increased emphasis in development of advanced packaging technologies. This paper aims to develop a practical method for thermal characterization of IC packages using the frequency-domain measurement technique as a complementary technique to the widely used time-domain thermal transient measurement technique. This paper discusses practical implementation of the technique and demonstrates both thermal modeling and experimental results. Thermal impedances measured in frequency-domain yield the structure function, which describes the dynamic thermal response of the device based on thermal RC network analysis. Various applications of this technique in thermal characterization of the IC packages subjected to field conditions are also discussed.

引用

页码：448 / 456

页数：9

共 18 条

[1] BAYESIAN DECONVOLUTION .1. CONVERGENT PROPERTIES [J].

KENNETT, TJ ;

PRESTWICH, WV ;

ROBERTSON, A .

NUCLEAR INSTRUMENTS & METHODS, 1978, 151 (1-2) :285-292

[2] Precision measurement and mapping of die-attach thermal resistance [J].

Kurabayashi, K ;

Goodson, KE .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (03) :506-514

[3] Challenges in thermal interface material testing [J].

Lasance, Clemens J. M. ;

Murray, Cameron T. ;

Saums, David L. ;

Rencz, Marta .

TWENTY SECOND ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2006, 2006, :42-+

[4]

Liu BM, 2005, EL PACKAG TECH CONF, P532

[5] THEORY OF NONUNIFORM RC LINES .I. ANALYTIC PROPERTIES AND REALIZABILITY CONDITIONS IN FREQUENCY DOMAIN [J].

PROTONOT.EN ;

WING, O .

IEEE TRANSACTIONS ON CIRCUIT THEORY, 1967, CT14 (01) :2-&

[6] Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities [J].

Rencz, M ;

Székely, V ;

Morelli, A ;

Villa, C .

EIGHTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2002, 2002, :15-20

[7] Measuring partial thermal resistances in heat-flow path [J].

Rencz, MR ;

Székely, V .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (04) :547-553

[8] Effective thermal diffusivity of layered materials measured by modulated photothermal techniques [J].

Salazar, A ;

Sanchez-Lavega, A ;

Terron, JM .

JOURNAL OF APPLIED PHYSICS, 1998, 84 (06) :3031-3041

[9]

Salleras M., 2006, P 7 INT C THERM MECH, P1, DOI [10.1109/ESIME.2006.1644029, DOI 10.1109/ESIME.2006.1644029]

[10]

Smith B, 2007, 13TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATION OF ICS AND SYSTEMS, PROCEEDINGS, P6

← 1 2 →