Thermally conductive polymer nanocomposites for filament-based additive manufacturing

被引:45
作者
Almuallim, Basel [1 ]
Harun, W. S. W. [1 ]
Al Rikabi, Ihab Jabbar [2 ]
Mohammed, Hussein A. [3 ]
机构
[1] Univ Malaysia Pahang, Inst Postgrad Studies, Kuantan 26300, Pahang, Malaysia
[2] Univ Teknol Malaysia, Sch Mech Engn, Fac Engn, Johor Baharu 81310, Johor, Malaysia
[3] Curtin Univ, WA Sch Mines Minerals Energy & Chem Engn, Perth, WA 6102, Australia
关键词
PHASE-CHANGE MATERIALS; CARBON NANOTUBE; PERCOLATION-THRESHOLD; MECHANICAL-PROPERTIES; ALUMINUM NITRIDE; ELECTRICAL-CONDUCTIVITY; GRAPHENE OXIDE; SELECTIVE LOCALIZATION; PHONON-SCATTERING; NATURAL FIBERS;
D O I
10.1007/s10853-021-06820-2
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Thermal management is a crucial factor affecting the performance and lifetime in several applications, such as electronics, generators, and heat exchangers. Additive manufacturing (AM) techniques provide a new revolution in manufacturing by expanding freedom for design and fabrication for complex geometries. One way to overcome these problems is by developing novel polymer-based composite materials with improved thermal conductivity properties for AM technologies. In this review, the fundamental principles of designing high thermal conductive polymer nanocomposites are presented. High thermal conductive polymer nanocomposites generally consist of the base polymer and thermally conductive filler materials such as aluminum oxide or boron nitride which are reviewed in detail. The factors affecting the thermal conductivity of composites, such as the filler loading and overall composite structure, are also summarized. This article stands on statistical data from technical papers published during 2000-2020 about the topics of fused deposition modeling (FDM) polymers or their thermal conductive composites. Finally, the most critical factors affecting the thermal conductivity of polymer nanocomposites are described in detail. Nonetheless, various novel techniques show the potential abilities of thermal conductivity of polymer nanocomposites usage by AM technologies, enabling applications in LED devices, energy, and electronic packaging.
引用
收藏
页码:3993 / 4019
页数:27
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