Thermal analysis of a wirebond chip-on-board package

被引：3

作者：

Pang, JHL ^{[1
]}

Tan, CK ^{[1
]}

机构：

[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore

来源：

ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS | 1998年

关键词：

D O I：

10.1109/ITHERM.1998.689607

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

The thermal characteristics of a wire-bond COB package with a calibrated thermal chip was investigated by wind tunnel experiments and finite element analysis. Thermal measurements were carried out in a wind tunnel used to simulate steady state natural and forced convection heat transfer conditions. Finite element analysis of the steady stale heat transfer condition was simulated using a two dimensional model of the wire-bond COB package. The finite element model was also employed in a thermal stress analysis of the wirebond COB package subjected to accelerated thermal cycling loading.

引用

页码：481 / 487

页数：7