Particles Detection and Analysis of Hard Disk Substrate after Post-CMP Cleaning

被引：0
作者：
Huang, Yating [1 ]
Lu, Xinchun [1 ]
Pan, Guoshun [1 ]
Lee, Bill [2 ]
Luo, Jianbin [1 ]
机构：
[1] Tsinghua Univ, State Key Lab Tribol, Beijing 100084, Peoples R China
[2] Shenzhen Kaifa Megnet Recording Co Ltd, Shenzhen, Peoples R China
来源：
ADVANCED TRIBOLOGY | 2009年
关键词：
Harddisk; post-CMPcleaning; particlecontamination; ADHESION; REMOVAL; MECHANISMS; ROUGH;
D O I：
10.1007/978-3-642-03653-8_256
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
Scrub, ultrasonic and megasonic are widely used in industry as post-CMP cleaning procedure. In this paper, experiments are taken to analyze the particle contaminations after each process. A scatter spot method has been exploited to exam the particles' location and features. SEM with EDX is used to observe and analyze the particles' shape and size as well as the elements. The results indicate that brush scrub is not sufficient for submicron abrasive particle removal. Megasonic is a better method of cleaning but contaminations like metallic particles and bacteria from the equipment may pollute the clean disk. The abrasive particles embedded in the plating pits are hard to remove by mechanical force. Pollution in the dryer is also discussed.
引用
收藏
页码：772 / +
页数：2
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