Theoretical analysis of temperature field in surface grinding with cup wheel

被引：17

作者：

Lin, B ^{[1
]}

Zhang, HL ^{[1
]}

机构：

[1] Tianjin Univ, State Educ Minist, Key Lab High Temp Struct Ceram & Machining Techno, Tianjin 300072, Peoples R China

来源：

ADVANCES IN ABRASIVE PROCESSES | 2001年 / 202-2卷

关键词：

moving heat source; cup wheel; grinding; temperature field; integral solution;

D O I：

10.4028/www.scientific.net/KEM.202-203.93

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A moving heat source model of cup wheel surface grinding is built. Three-dimensional quasi-steady temperature field in workpiece without coolant is analyzed and its formula is obtained based on this thermal model and the theory of heat conduction. The theoretical calculation shows that cup wheel surface grinding temperature field takes on non-uniform shape. The result is also helpful to analyses other thermal problems emerged in mechanical operations such as cutting and milling.

引用

页码：93 / 98

页数：6

共 10 条

[1]

Hou Z., 1984, HEAT CONDUCED SOLID

[2]

Jaeger J.C., 1986, CONDUCTION HEAT SOLI

[3]

JEAGER JC, 1942, P ROYAL SOC NEW S WA, V76, P203

[4] THERMAL ASPECTS OF GRINDING .2. SURFACE TEMPERATURES AND WORKPIECE BURN [J].

MALKIN, S .

JOURNAL OF ENGINEERING FOR INDUSTRY-TRANSACTIONS OF THE ASME, 1974, 96 (04) :1184-1191

[5]

MERCIER RJ, 1978, T ASME, V100, P43

[6]

OUTWATER J, 1952, T ASME, V73, P73

[7]

Ren JX, 1988, PRINCIPLE GRINDING

[8]

Rosenthal D., 1946, Trans. ASME, V68, P849, DOI DOI 10.1115/1.4018624

[9]

YUAN ZJ, 1999, 6 ANN CUSMAMT

[10]

ZHENG HW, 1994, ANN CIRP, V43, P287

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