Microscopic Deformation of Polycrystalline Pure Copper Wire during Tension

被引:0
作者
Tada, Naoya [1 ]
Matsukawa, Yoshitaka [2 ]
Uemori, Takeshi [1 ]
Nakata, Toshiya [1 ]
机构
[1] Okayama Univ, Grad Sch Nat Sci & Technol, Kita Ku, 3-1-1 Tsushimanaka, Okayama 7008530, Japan
[2] Murata Mfg Co Ltd, 10-1 Higashikotari 1 Chome, Nagaokakyo 6178555, Japan
来源
2015 10TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) | 2015年
关键词
BEHAVIOR; FATIGUE;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In order to clarify the inhomogeneous deformation of thin copper wire, an interrupted tensile test was carried out on the stage of the digital holographic microscope (DHM). The inhomogeneity was evaluated based on the non-uniform change in height distribution on the surface of thin wire specimen during the test. Microscopic plastic deformation by a unit of crystal grain and large gradient in height distribution along grain boundaries were observed. The increase in average height of grain between two earlier loading steps corresponded to that between two later loading steps. This result suggests that the microscopic deformation at the latter stage of tension is predictable from that at the early stage of the tension.
引用
收藏
页码:229 / 232
页数:4
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