A 0.5-μm CMOS T/R switch for 900-MHz wireless applications

被引:147
作者
Huang, FJ [1 ]
O, K [1 ]
机构
[1] Univ Florida, Dept Elect & Comp Engn, Silicon Microwave Integrated Circuits & Syst Res, Gainesville, FL 32611 USA
基金
美国国家科学基金会;
关键词
CMOS integrated circuits; microwave switches; MOSFET switches;
D O I
10.1109/4.910487
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A single-pole double-throw transmit/receive switch for 3.0-V applications has been fabricated in a 0.5-mum CMOS process. An analysis shows that substrate resistances and source/drain-to-body capacitances must be lowered to decrease insertion loss. The switch exhibits a 0.7-dB insertion loss, a 17-dBm power 1-dB compression point (P-1dB), and a 42-dB isolation at 928 MHz. The low insertion loss is achieved by optimizing the transistor widths and bias voltages, by minimizing the substrate resistances, and by de biasing the transmit and receive nodes, which decreases the capacitances while increasing the power 1-dB compression point. The switch has adequate insertion loss, isolation, P-1dB, and IP3 for a number of 900-Mhz ISM band applications requiring a moderate peak transmitter power level (similar to 15 dBm).
引用
收藏
页码:486 / 492
页数:7
相关论文
共 12 条
[1]  
*AV CORP, 1998, STAR HSPIC MAN
[2]   Linear and nonlinear characteristics of the silicon CMOS monolithic 50-Ω microwave and RF control element [J].
Caverly, RH .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1999, 34 (01) :124-126
[3]   Effects of substrate resistances on LNA performance and a bondpad structure for reducing the effects in a silicon bipolar technology [J].
Colvin, JT ;
Bhatia, SS ;
O, KK .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1999, 34 (09) :1339-1344
[4]  
Gonzalez G., 1997, Microwave transistor amplifiers: analysis and design, VSecond
[5]  
*HITT MICR CORP, 2000, STAND PROD CAT
[6]  
Hu C., 1985, International Electron Devices Meeting. Technical Digest (Cat. No. 85CH2252-5), P368
[7]  
HUANGFJ, 2000, P IEEE 2000 CICC ORL, P341
[8]   High-Q capacitors implemented in a CMOS process for low-power wireless applications [J].
Hung, CM ;
Ho, YC ;
Wu, IC ;
O, K .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1998, 46 (05) :505-511
[9]   A GAAS HIGH-POWER RF SINGLE POLE DUAL THROW SWITCH IC FOR DIGITAL MOBILE COMMUNICATION-SYSTEM [J].
MIYATSUJI, K ;
UEDA, D .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1995, 30 (09) :979-983
[10]   LOW-COST AND LOW-POWER SILICON NPN BIPOLAR PROCESS WITH NMOS TRANSISTORS (ADRF) FOR RF AND MICROWAVE APPLICATIONS [J].
O, K ;
GARONE, P ;
TSAI, C ;
DAWE, G ;
SCHARF, B ;
TEWKSBURY, T ;
KERMARREC, C ;
YASAITIS, J .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1995, 42 (10) :1831-1840