The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach

被引:28
作者
Kim, Yong-Jae [1 ,2 ]
Park, Byung-Ho [1 ]
Hyun, Soong-Keun [2 ]
Nishikawa, Hiroshi [1 ]
机构
[1] Osaka Univ, Joining & Welding Res Inst, 11-1 Mihogaoka, Ibaraki, Osaka 5670047, Japan
[2] Inha Univ, Dept Mat Sci & Engn, Incheon 22212, South Korea
来源
MATERIALS TODAY COMMUNICATIONS | 2021年 / 29卷
关键词
Ag sintering; Porosity; Thermal conductivity; Steady state; AG PARTICLE PASTE; MEAN FREE-PATH; LOW-TEMPERATURE; SHEAR-STRENGTH; FREE SOLDERS; RELIABILITY; MODULES;
D O I
10.1016/j.mtcomm.2021.102772
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Thermal conductivity of a Ag sintered joint was measured using the steady-state comparison method. The results showed that with the increasing sintering temperature, the thermal conductivity increased from 126.3 to 228.5 W/m.K and the corresponding porosity of the Ag sintered joint decreased from 23.4% to 8.4%. However, except for the porosity, there were other factors, such as pore size and pore shape, that affect the thermal conductivity of the Ag sintered joint. Their effects on the thermal conductivity was considered quantitatively by introducing the thermal resistance index of pore (TRIP). The TRIP results showed that the fraction having low TRIP values increased with increasing sintering temperature increased. This indicates that as the sintering temperature increases, the pores of the sintered joint become smaller and develop a more spherical shape, thereby resulting in minimizing a reduction of the thermal conductivity despite no change in the porosity.
引用
收藏
页数:10
相关论文
共 50 条
  • [41] Modeling of Young's modulus and thermal conductivity evolution of partially sintered alumina ceramics with pore shape changes from concave to convex
    Uhlirova, Tereza
    Necina, Vojtech
    Pabst, Willi
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2018, 38 (08) : 3004 - 3011
  • [42] Relationship between Transient Thermal Impedance and Shear Strength of Pressureless Sintered Silver as Die Attachment for Power Devices
    Wang, M. Y.
    Mei, Y. H.
    Li, X.
    Lu, G-Q.
    2015 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC), 2015, : 559 - 564
  • [43] Evaluation of thermal conductivity for sintered silver considering aging effect with microstructure based model
    Qin, Fei
    Hu, Yuankun
    Dai, Yanwei
    An, Tong
    Chen, Pei
    MICROELECTRONICS RELIABILITY, 2020, 108
  • [44] Analysis of shape dependency of thermal conductivity of silver-based nanofluids
    Smita Mahadevappa Nyamgoudar
    Vasavi Prasuna Silaparasetti
    M. P. Shilpa
    K. S. Pavithra
    Shridhar Mundinamani
    K. M. Eshwarappa
    Srivathsava Surabhi
    Koduri Ramam
    A. Ravikirana
    S. C. Ganesha
    Journal of Thermal Analysis and Calorimetry, 2022, 147 : 14031 - 14038
  • [45] Analysis of shape dependency of thermal conductivity of silver-based nanofluids
    Nyamgoudar, Smita Mahadevappa
    Silaparasetti, Vasavi Prasuna
    Shilpa, M. P.
    Pavithra, K. S.
    Mundinamani, Shridhar
    Eshwarappa, K. M.
    Surabhi, Srivathsava
    Ramam, Koduri
    Ravikirana
    Ganesha, A.
    Gurumurthy, S. C.
    JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2022, 147 (24) : 14031 - 14038
  • [46] INFLUENCE OF POROSITY ON THERMAL CONDUCTIVITY AND SINTERING IN SUSPENSION PLASMA SPRAYED THERMAL BARRIER COATINGS
    Kassner, H.
    Stuke, A.
    Roedig, M.
    Vassen, R.
    Shoever, D.
    ADVANCED CERAMIC COATINGS AND INTERFACES III, 2009, 29 (04): : 147 - 158
  • [47] Influence of porosity formation on irradiated UO2 fuel thermal conductivity at high burnup
    Roostaii, B.
    Kazeminejad, H.
    Khakshournia, S.
    JOURNAL OF NUCLEAR MATERIALS, 2016, 479 : 374 - 381
  • [48] Ceramic tiles with controlled porosity and low thermal conductivity by using pore-forming agents
    Novais, Rui M.
    Seabra, M. P.
    Labrincha, J. A.
    CERAMICS INTERNATIONAL, 2014, 40 (08) : 11637 - 11648
  • [49] On the Elimination of Die Attach Defects Occurrence - Optimization of Silver Sinter Curing Profile Using Simultaneous Thermal Analyses
    Pulutan, Marty Lorgino
    Villacarlos, Bobby Johns
    2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2019, : 294 - 299
  • [50] Effect of perforation shape and porosity on effective thermal conductivity of matrix heat exchanger plates
    Navaneethakrishnan, P.
    Krishnakumar, K.
    John, Anish K.
    APPLIED THERMAL ENGINEERING, 2016, 106 : 432 - 437