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- [27] A Parametric Simulative Study for Lifetime Prediction of Sintered Silver Die Attach Under Different Accelerated Testing Conditions 2021 22ND INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2021,
- [30] Effect of Substrate Surface Finish on Bonding Strength of Pressure-less Sintered Silver Die-attach 2018 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC), 2018, : 50 - 54