Wireless communication in a flip-chip package using integrated antennas on silicon substrates

被引：36

作者：

Branch, J ^{[1
]}

Guo, X ^{[1
]}

Gao, L ^{[1
]}

Sugavanam, A ^{[1
]}

Lin, JJ ^{[1
]}

O, KK ^{[1
]}

机构：

[1] Univ Florida, Dept Elect & Comp Engn, Silicon Microwave Integrated Circuits & Syst Res, Gainesville, FL 32611 USA

来源：

IEEE ELECTRON DEVICE LETTERS | 2005年 / 26卷 / 02期

基金：

美国国家航空航天局;

关键词：

flip-chip package; integrated antennas; wireless interconnection;

D O I：

10.1109/LED.2004.841461

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An intrachip wireless interconnect using integrated antennas is demonstrated in a flip-chip ball grid array package. The wireless interconnect consists of a transmitter-receiver pair, which is fabricated in a 0.18-mum CMOS process. A 15-GHz signal is generated and broadcasted across the integrated circuit. The signal is picked up by a receiver 4 mm away on the same integrated circuit and frequency divided by eight to produce a 1.875-GHz local clock signal. The interconnection is also demonstrated between a transmitting antenna and a packaged receiver 40 cm away from the transmitting antenna. Demonstration of intrachip wireless interconnects in a package has been considered the ultimate test for this technology.

引用

页码：115 / 117

页数：3

共 12 条

[1] [Anonymous], 2002, INT TECHNOLOGY ROADM
[2] Jitter in a wireless clock distribution system
Dickson, T
Floyd, B
O, K
[J]. PROCEEDINGS OF THE IEEE 2002 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2002, : 154 - 156
[3] DICKSON TO, 2001, P IEEE INT S EMC, V1, P340
[4] Floyd B., 2000, 2000 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.00CH37056), P328, DOI 10.1109/ISSCC.2000.839802
[5] Intra-chip wireless interconnect for clock distribution implemented with integrated antennas, receivers, and transmitters
Floyd, BA
Hung, CM
O, KK
[J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2002, 37 (05) : 543 - 552
[6] FLOYD BA, 2001, THESIS U FLORIDA GAI
[7] Propagation layers for intra-chip wireless interconnection compatible with packaging and heat removal
Guo, XL
Caserta, J
Li, R
Floyd, B
O, KK
[J]. 2002 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2002, : 36 - 37
[8] On-chip wireless interconnection with integrated antennas
Kim, K
Yoon, H
O, KK
[J]. INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, : 485 - 488
[9] KIM K, 2001, P IEEE INT S AP S BO, V2, P166
[10] KIM KKO, 1999, P 1999 GOMAC MAR, P306

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