General model for estimating bubble dissolution and droplet evaporation times

被引：14
|
作者：
Shedd, TA [1 ]
机构：
[1] Univ Wisconsin, Computat Mech Ctr, Dept Mech Engn, Madison, WI 53706 USA
来源：
JOURNAL OF MICROLITHOGRAPHY MICROFABRICATION AND MICROSYSTEMS | 2005年 / 4卷 / 03期
关键词：
submicron lithography; bubble dissolution; evaporation; flows; water;
D O I：
10.1117/1.2037427
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Bubbles and droplets may be detrimental to the successful implementation of immersion lithography, depending in part on their lifetime in the system. In this work, a model is developed to estimate the dissolution times of nitrogen bubbles in pure water that may be freefloating or adhered to a solid surface. The model is then extended to small free and adhered droplets. Bubble dissolution and droplet evaporation times for typical immersion lithography conditions are presented. (c) 2005 Society of Photo-Optical Instrumentation Engineers.
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页数：8
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