An X-ray study on the mechanical effects of the peel test in a Cu/Cr/polyimide system

被引:38
作者
Park, IS [1 ]
Yu, J [1 ]
机构
[1] KAIST, Dept Mat Sci & Engn, Seoul, South Korea
关键词
D O I
10.1016/S1359-6454(97)00208-5
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In order to understand the effects of plastic deformation and the interfacial fracture energy on the peel strength, thickness of the metal layer and the pretreatment conditions of polyimide were varied in the Cu/Cr polyimide system. The work expenditure during the peel test was estimated using the stress-strain curves of metal films, X-ray measurements of the plastic strain in peeled films, and the elastoplastic beam analysis. Results indicate that the peel strength is strongly affected by the film thickness and the pretreatment condition in a synergistic way, and that the peel strength shows a maximum at an intermediate thickness level. The estimated work expenditure was close to measured peel strength for most of the cases, which indicates that the measured peel strength is more a measure of the plastic deformation during the peel test than a measure of the true interfacial fracture energy. (C) 1997 Acta Metallurgica Inc.
引用
收藏
页码:2947 / 2953
页数:7
相关论文
共 18 条
[1]  
AHN EC, 1996, THESIS KAIST
[2]   ON THE MECHANICS OF ADHESION TESTING OF FLEXIBLE FILMS [J].
ARAVAS, N ;
KIM, KS ;
LOUKIS, MJ .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1989, 107 :159-168
[3]  
BUNSHAH RF, 1982, DEPOSITION TECHNOLOG, P385
[4]  
CHOU NJ, 1984, J VAC SCI TECHNOL A, V2, P751, DOI 10.1116/1.572564
[5]   AN AUGER STUDY ON THE INTERACTION OF CU AND CR FILMS WITH POLYIMIDE [J].
CHUNG, TG ;
KIM, YH ;
YU, J .
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1994, 8 (01) :41-51
[6]  
EVANS AG, 1995, MECH274 DAS HARV U
[7]   SYNCHROTRON-RADIATION EXCITED CARBON 1S PHOTOEMISSION-STUDY OF CR-ORGANIC POLYMER INTERFACES [J].
JORDAN, JL ;
SANDA, PN ;
MORAR, JF ;
KOVAC, CA ;
HIMPSEL, FJ ;
POLLAK, RA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (03) :1046-1048
[8]   MECHANICAL EFFECTS IN PEEL ADHESION TEST [J].
KIM, J ;
KIM, KS ;
KIM, YH .
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1989, 3 (03) :175-187
[9]   ELASTOPLASTIC ANALYSIS OF THE PEEL TEST [J].
KIM, KS ;
ARAVAS, N .
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 1988, 24 (04) :417-435
[10]   ELASTO-PLASTIC ANALYSIS OF THE PEEL TEST FOR THIN-FILM ADHESION [J].
KIM, KS ;
KIM, J .
JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, 1988, 110 (03) :266-273