High breakdown voltage (> 1000 V) semi-superjunction MOSFETs using 600-V class superjunction MOSFET process

被引:31
作者
Saito, W [1 ]
Omura, I [1 ]
Aida, S [1 ]
Koduki, S [1 ]
Izumisawa, M [1 ]
Yoshioka, H [1 ]
Ogura, T [1 ]
机构
[1] Toshiba Co Ltd, Semicond Co, Kawasaki, Kanagawa 2128583, Japan
关键词
high-voltage device; on-resistance; power MOSFETs; superjunction;
D O I
10.1109/TED.2005.856804
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Si-MOSFETs with the breakdown voltage of over 1000 V were demonstrated, for the first time, realizing low on-resistance below the theoretical Si limit. The fabricated MOSFETs have a semi-superjunction (SemiSJ) structure, which is the combination of a superjunction (SJ) structure and an n-bottom assisted layer. The SemiSJ MOSFETs realize both the high breakdown voltage of 1110 and 1400 V and the low on-resistance of 54 and 163 m Omega cm(2), respectively. The fabrication process for the high-voltage SemiSJ-MOSFET was completely equivalent, to a 600-V class SJ-MOSFET process, which implies that a single optimized process for forming SJ structure for 600 V-class MOSFET can be used for a wide voltage range extending up to 1200. V MOSFET. Additionally the fabricated MOSFETs realized low R(on)Q(gd) of 4.6 Omega nC for a 1110-V device and 13.1 Omega nC for a 1400-V device, and recovery characteristics of the body diode were softer than those for the SJ MOSFET. These results show the possibility of new Si power-MOSFET with a higher application voltage range.
引用
收藏
页码:2317 / 2322
页数:6
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