DEVELOPMENT OF BOUNDARY CONDITION INDEPENDENT COMPACT THERMAL MODELS FOR OPTO-ELECTRONIC PACKAGES

In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called SFP (Small Form-factor Pluggable Device). This is done using the DELPHI (DEvelopment of Libraries of PHysical models for an Integrated design) Methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction, and typically has four heat generating sources. The detailed model for the SFP is constructed and validated using a natural convection experiment. The validated detailed model is used for generating the Boundary-Condition-Independent (BCI) Compact Thermal Model (CTM). Codes for solving the network topology and interfacing with the optimization subroutine were written using Mat lab 7. The resulting CTM is extensively validated with multiple boundary condition sets. The CTM for the SFP shows maximum relative of errors less than 10% for the junction temperature on all of its active components and less than 20% for the heat flows through its sides for extreme set of boundary conditions.