Growth of electrolytic copper dendrites and their adhesion to an epoxy resin

被引：18
作者：
Sun, BK
O'Keefe, TJ
机构：
[1] Samsung Electromech Amer Inc, San Jose, CA 95134 USA
[2] Univ Missouri, Grad Ctr Mat Res, Rolla, MO 65401 USA
来源：
SURFACE & COATINGS TECHNOLOGY | 1998年 / 106卷 / 01期
关键词：
adhesion strength; copper microdendrite; deposit morphology; limiting current density;
D O I：
10.1016/S0257-8972(98)00488-5
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Microdendritic copper deposits of various morphologies were electrolytically produced and bonded with an epoxy resin. The adhesion strength and failure mode of the copper bond were evaluated by means of T-type peel tests and SEM, EDS surface analyses. The general effects of independent process parameters on deposit quality and adhesion were studied. It was found that microdendritic deposits of relatively high surface area and strength produced electrolytically improved adhesion between metal and polymeric adhesive through enhanced mechanical interlocking or anchoring. (C) 1998 Elsevier Science S.A.
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收藏
页码：44 / 52
页数：9
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