Comparison of corrosion behavior of soldering alloys and joints

被引：0

作者：

Yang, Fen ^{[1
]}

Wang, Lihua ^{[1
]}

Li, Xiaogang

Zhao, Jie ^{[1
]}

机构：

[1] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China

来源：

TRANSFERABILITY AND APPLICABILITY OF CURRENT MECHANICS APPROACHES | 2009年

关键词：

Solder; Joint; Corrosion behavior; Lead-free; Corrosion solution; Dissolution amount;

D O I：

暂无

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

The corrosion resistance of three solders, Sn-Pb, Sn-9Zn, Sn-3.5Ag-0.5Cu, and their soldering joints were investigated in 3.5% NaCl, pH = 10 NaOH and pH = 4 H2SO4 solution, respectively. The microstructure and composition of the corrosion products were analyzed by SEM and X-ray diffraction (XRD) to identify the corrosion products from the different solder materials after dissolution tests. Whether solder or joint, Sn-3.5Ag-0.5Cu exhibit much better corrosion resistance than Sn-37Pb and Sn-9Zn in NaOH and H2SO4 solution. While the corrosion resistance of Sn-3.5Ag-0.5Cu joint in NaCl saline solution is the worst among all of the tests.

引用

页码：501 / 506

页数：6

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