Development of thin film resistors for use in multichip modules

被引：13

作者：

Coates, KL ^{[1
]}

Chien, CP ^{[1
]}

Hsiao, YYR ^{[1
]}

Kovach, DJ ^{[1
]}

Tang, CH ^{[1
]}

Tanielian, MH ^{[1
]}

机构：

[1] Boeing Co, Seattle, WA 98124 USA

来源：

1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS | 1998年

关键词：

thin film; tantalum nitride; resistor; MCM-D; embedded passives;

D O I：

10.1109/ICMCM.1998.670829

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Boeing's current process is based on polyimide dielectric and Cu interconnects passivated with thin film Ti. Materials and processes are being developed to integrate passive components (resistors, capacitors and inductors) into these MCM-D substrates in order to make further improvements in Boeing's electronics technology. By embedding passive components into MCMs, the size, weight, and cost of MCMs can be minimized while improving performance and reliability. This paper describes the development of low value, TaNx resistor elements suitable for integrating into MCMs. The criteria for the resistor fabrication technology was that it be based on thin film processing for compatibility with the MCM-D fabrication process. Development of both the TaNx thin film deposition process and the patterned resistor fabrication process are discussed. X-ray analysis of the TaNx film,resistor trimming, environmental test results, and integration into an MCM structure are also described.

引用

页码：490 / 495

页数：6