The effect of Ti and TiN barrier layers on the stress and adhesion of Cu thin films deposited on Si

被引：0
|
作者：
Beegan, D [1 ]
Laugier, MT [1 ]
Arshak, A [1 ]
机构：
[1] Univ Limerick, Dept Phys, Limerick, Ireland
来源：
SURFACE TREATMENT V: COMPUTER METHODS AND EXPERIMENTAL MEASUREMENTS | 2001年 / 6卷
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中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
The effect of Ti and TiN barrier layers on the mechanical and electrical properties of RF magnetron sputtered Cu thin films is investigated. The relationship between the mechanical properties of film stress and adhesion is investigated in the two-layer film structure by indentation techniques. Changes in the length of indentation cracks are attributed to stresses in the films. Adhesion is determined from the scratch test. The resistivity of the films was measured by four-point probe and the films were characterised by AFM and XRD.
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页码：43 / 53
页数：11
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