Real 3D electro-thermal simulation and analysis for ESD protection structures

被引：0

作者：

Xie, HL ^{[1
]}

Zhan, RY ^{[1
]}

Wang, A ^{[1
]}

Gafiteanu, R ^{[1
]}

机构：

[1] IIT, Dept Elect & Comp Engn, Integrated Elect Lab, Chicago, IL 60616 USA

来源：

ICCDCS 2004: FIFTH INTERNATIONAL CARACAS CONFERENCE ON DEVICES, CIRCUITS AND SYSTEMS | 2004年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a three-dimensional electro-thermal analysis for ESD (electrostatic discharge) protection structures, aiming for accurately predicting ESD electro-thermal failure threshold and better understanding ESD protection device thermal resistance. An accurate 3D electro-thermal analysis method using real 3D TCAD simulation 11, 21 was developed. 3D simulation was compared with experimental data using transmission line pulse (TLP) measurements for characterizing ESD protection devices. Accurate electro-thermal analysis is essential to understanding thermal behaviors of ESD protection structures under high-current stressing.

引用

页码：61 / 64

页数：4

共 50 条

[1] 3D electro-thermal modeling of GGNMOS ESD protection structure
Xie, HL
Zhan, RY
Wang, A
Gafiteanu, R
PROCEEDINGS OF THE 2004 IEEE ASIA-PACIFIC CONFERENCE ON CIRCUITS AND SYSTEMS, VOL 1 AND 2: SOC DESIGN FOR UBIQUITOUS INFORMATION TECHNOLOGY, 2004, : 61 - 64
[2] 3D Electro-Thermal Modeling for ESD protection structures in Sub-100nm CMOS
Lin, L.
Wang, X.
Liu, J.
Wang, A.
Liu, H.
Zhou, Y.
Yang, L.
2008 2ND IEEE INTERNATIONAL NANOELECTRONICS CONFERENCE, VOLS 1-3, 2008, : 520 - +
[3] Enhanced 3D, EM and electro-thermal simulation for wireless design
1600, Horizon House (60):
[4] Localized Statistical 3D Thermal Analysis Considering Electro-Thermal Coupling
Luo, Zuying
Fan, Jeffrey
Tan, Sheldon X. -D.
ISCAS: 2009 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1-5, 2009, : 1289 - +
[5] Rapid Electro-Thermal Modeling for 3D Integration Using Circuit Simulation Techniques
Shiue, Gene
Schutt-Aine, Jose
2018 JOINT IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND 2018 IEEE ASIA-PACIFIC SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC/APEMC), 2018, : 63 - 63
[6] Preliminary 3D TCAD Electro-thermal Simulations of BIMOS transistor in thin silicon film for ESD protection in FDSOI UTBB CMOS technology
Athanasiou, S.
Cristoloveanu, S.
Galy, Ph
2015 INTERNATIONAL CONFERENCE ON IC DESIGN & TECHNOLOGY (ICICDT), 2015,
[7] Electro-thermal analysis of IGBT module from 3D CAD model
Wang, Hui
Gong, Ding
Shen, Chen
17TH IEEE INTERNATIONAL CONFERENCE ON IC DESIGN AND TECHNOLOGY (ICICDT 2019), 2019,
[8] Quasi-3D Electro-Thermal Simulation of Integrated Transistor Structures, IC Chips and Packages
Petrosyants, Konstantin O.
Ryabov, Nikita I.
2016 INTERNATIONAL SIBERIAN CONFERENCE ON CONTROL AND COMMUNICATIONS (SIBCON), 2016,
[9] Thermal mapping and 3D numerical simulation of new cellular power MOS affected by electro-thermal instability
Breglio, G
Rinaldi, N
Spirito, P
MICROELECTRONICS JOURNAL, 2000, 31 (9-10) : 741 - 746
[10] 3D Integration ESD Protection Design and Analysis
Mitra, Souvick
Gebreselasie, Ephrem
Li, You
Gauthier, Robert
Silberman, Joel
Tyberg, Christy
Sakuma, Katsuyuki
Thuy Tran-Quinn
Ramachandran, Koushik
Angyal, Matthew
2015 37TH ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM (EOS/ESD), 2015,

← 1 2 3 4 5 →