Real 3D electro-thermal simulation and analysis for ESD protection structures

被引：0

作者：

Xie, HL ^{[1
]}

Zhan, RY ^{[1
]}

Wang, A ^{[1
]}

Gafiteanu, R ^{[1
]}

机构：

[1] IIT, Dept Elect & Comp Engn, Integrated Elect Lab, Chicago, IL 60616 USA

来源：

ICCDCS 2004: FIFTH INTERNATIONAL CARACAS CONFERENCE ON DEVICES, CIRCUITS AND SYSTEMS | 2004年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a three-dimensional electro-thermal analysis for ESD (electrostatic discharge) protection structures, aiming for accurately predicting ESD electro-thermal failure threshold and better understanding ESD protection device thermal resistance. An accurate 3D electro-thermal analysis method using real 3D TCAD simulation 11, 21 was developed. 3D simulation was compared with experimental data using transmission line pulse (TLP) measurements for characterizing ESD protection devices. Accurate electro-thermal analysis is essential to understanding thermal behaviors of ESD protection structures under high-current stressing.

引用

页码：61 / 64

页数：4

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