Growth Characteristics and Film Properties of Cerium Dioxide Prepared by Plasma-Enhanced Atomic Layer Deposition

被引:34
作者
Kim, Woo-Hee [1 ,2 ]
Kim, Min-Kyu [1 ]
Maeng, W. J. [3 ]
Gatineau, Julien [4 ]
Pallem, Venkat [5 ]
Dussarrat, Christian [5 ]
Noori, Atif [6 ]
Thompson, David [6 ]
Chu, Schubert [6 ]
Kim, Hyungjun [1 ]
机构
[1] Yonsei Univ, Sch Elect & Elect Engn, Seoul 120749, South Korea
[2] Pohang Univ Sci & Technol, Dept Mat Sci & Engn, Pohang 790784, South Korea
[3] Samsung Adv Inst Technol, Display Lab, Nongseo Dong 446712, Yongin, South Korea
[4] KK Air Liquide Labs, Tsukuba, Ibaraki 3004247, Japan
[5] Air Liquide Adv Technol US, Newark, DE 19702 USA
[6] Appl Mat Inc, Sunnyvale, CA 94085 USA
关键词
CEO2; THIN-FILMS; ELECTRICAL-PROPERTIES; SILICON; OXIDE; SPECTROSCOPY; TEMPERATURE; METAL; ALD;
D O I
10.1149/1.3594766
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
CeO(2) thin films were deposited by plasma-enhanced atomic layer deposition (PE-ALD). Novel Ce(iPrCp)(3) [tris(isopropyl-cyclopentadienyl) cerium] was used as a Ce precursor, which showed clean evaporation with no residue and good thermal stability. For PE-ALD, O(2) plasma was used as an oxidizing reactant. The PE-ALD process exhibited ALD mode with good self-saturation behavior and linear growth without any nucleation delay on Si substrate as a function of growth cycles. Additionally, it produced highly pure and nearly stoichiometric CeO(2) films with polycrystalline cubic phases. Electrical properties of Al/CeO(2)/p-Si capacitors were improved by O(2) annealing with reduction in interface state density (D(it)), hysteresis, effective oxide charge (Q(eff)) and leakage current density. These experimental results indicate that the PE-ALD CeO(2) using Ce(iPrCp)(3) precursor can be viable option as a future high-k material in the microelectronic industry. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3594766] All rights reserved.
引用
收藏
页码:G169 / G172
页数:4
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