Electrothermal Characteristics Research of High-power LED in Pulse Drive Mode

被引：0

作者：

Wang, Hongmin ^{[1
]}

Guo, Haiqing ^{[1
]}

Yu, Wenlong ^{[2
]}

机构：

[1] Harbin Univ Sci & Technol, Opt & Elect Engn Res Ctr, Harbin, Peoples R China

[2] Mudanjiang Inspect & Testing Ctr Qual & Tech Supe, Mudanjiang, Peoples R China

来源：

PROCEEDINGS OF 2013 2ND INTERNATIONAL CONFERENCE ON MEASUREMENT, INFORMATION AND CONTROL (ICMIC 2013), VOLS 1 & 2 | 2013年

关键词：

high power LED; Pulse current source; Luminous flux; Luminous efficiency; Electric properties; THERMAL-ANALYSIS;

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Current study of LED device electrothermal characteristics are basically under the condition of DC drive performance. The electrothermal characteristics of LED in pulse drive mode is not given. So this article in view of the pulse drive mode of high power LED light electrothermal characteristics are studied. This paper measured parameters such as luminous flux, luminous efficiency, substrate temperature of high power LED in the pulsed drive mode and DC drive mode. After getting the result of comparative analysis, it concluded that the electrothermal characteristics of high power LED in the pulsed drive mode. It shows that the flux and luminous efficiency are less ideal than DC pulsed condition. With the loss of the pulsed signal duty cycle, the flux and the luminous efficiency are lower. However, in the pulsed drive mode, the temperature of LED junction is significantly lower than it in DC condition.

引用

页码：941 / 945

页数：5

共 10 条

[1] Biber C, 2008, P IEEE SEMICOND THER, P182
[2] Dai Guoding, 2010, J SEMICONDUCTORS, V31, P121
[3] Study on the effect of the relative position of the phosphor layer in the LED package on the high power LED lifetime
Hwang, Jung-Ha
Kim, Yu-Dong
Kim, Jae-Wook
Jung, Su-Jung
Kwon, Ho-Ki
Oh, Tchang-Hun
[J]. PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 7, NO 7-8, 2010, 7 (7-8):
[4] Thermal transient characteristics of die attach in high power LED PKG
Kim, Hyun-Ho
Choi, Sang-Hyun
Shin, Sang-Hyun
Lee, Young-Ki
Choi, Seok-Moon
Yi, Sung
[J]. MICROELECTRONICS RELIABILITY, 2008, 48 (03) : 445 - 454
[5] Thermal analysis of high power LED package with heat pipe heat sink
Lu, Xiang-you
Hua, Tse-Chao
Wang, Yan-ping
[J]. MICROELECTRONICS JOURNAL, 2011, 42 (11) : 1257 - 1262
[6] High power light emitting diode (LED) arrays versus halogen light polymerization of oral biomaterials: Barcol hardness, compressive strength and radiometric properties
Mills, RW
Uhl, A
Blackwell, GB
Jandt, KD
[J]. BIOMATERIALS, 2002, 23 (14) : 2955 - 2963
[7] L-type heat pipes application in electronic cooling system
Wang, Jung-Chang
[J]. INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2011, 50 (01) : 97 - 105
[8] Wei Guo, 2010, J SEMICONDUCTORS, V31, P94
[9] Thermal analysis of high power GaN-based LEDs with ceramic package
Yang, Lianqiao
Jang, Sunho
Hwang, Woongjoon
Shin, Moowhan
[J]. THERMOCHIMICA ACTA, 2007, 455 (1-2) : 95 - 99
[10] Dependence of the stability of organic light-emitting diodes on driving mode
Zhang WenWen
Wu ZhaoXin
Zhang XinWen
Liang ShiXiong
Jiao Bo
Hou Xun
[J]. CHINESE SCIENCE BULLETIN, 2011, 56 (21): : 2210 - 2214

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