Augmented finite element method (AFEM) for the linear steady-state thermal and thermomechanical analysis of heterogeneous integration architectures

被引:1
作者
Avula, Venkatesh [1 ]
Smet, Vanessa [2 ]
Joshi, Yogendra [2 ]
Swaminathan, Madhavan [1 ,3 ]
机构
[1] Georgia Inst Technol, Sch Elect & Comp Engn, 3D Syst Packaging Res Ctr, Atlanta, GA 30332 USA
[2] Georgia Inst Technol, George W Woodruff Sch Mech Engn, 3D Syst Packaging Res Ctr, Atlanta, GA 30332 USA
[3] Georgia Inst Technol, Sch Mat Sci & Engn, 3D Syst Packaging Res Ctr, Atlanta, GA 30332 USA
来源
PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021) | 2021年
关键词
Finite element method; Multiphysics modeling; thermomechanical reliability; heterogeneous integration;
D O I
10.1109/ITherm51669.2021.9503131
中图分类号
O414.1 [热力学];
学科分类号
摘要
The thermal and thermomechanical reliability analysis of a package is often performed under cyclic loading conditions. An enhanced finite element method to efficiently solve for the steady-state temperature and stress responses arising out of such analysis is presented in this paper. It belongs to and extends the harmonic balance finite element method (HBFEM) technique for the case of a periodic switched linear (PSL) system. The method captures the periodic time-varying nature in the spectral domain. By relying on the time-invariant basis, the method addresses the time-scale and coupling challenges that exist with the traditional time-domain methods for the multiphysics modeling and analysis of the electronic packages. Its computational efficiency is verified on the power-cyclic thermal and thermomechanical analysis of a panel-embedded package.
引用
收藏
页码:947 / 953
页数:7
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