Damping characteristics of Sn-3Ag-0.5Cu and Sn-37Pb solders studied by dynamic mechanical analysis

被引：20

作者：

Chang, S. H. ^{[2
]}

Wu, S. K. ^{[1
]}

机构：

[1] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei 106, Taiwan

[2] Natl Ilan Univ, Dept Chem & Mat Engn, Ilan 260, Taiwan

来源：

SCRIPTA MATERIALIA | 2010年 / 63卷 / 10期

关键词：

Soldering; Dynamic mechanical analysis; Metal and alloys; Damping; HIGH-TEMPERATURE; INTERNAL-FRICTION; ALLOYS; JOINTS; PB; SN; MG;

D O I：

10.1016/j.scriptamat.2010.07.004

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Sn-37Pb solder and pure Sn metal exhibit a conspicuous high-temperature damping background (HTDB) in low-frequency internal friction Q(-1) (T) curves with activation energies, H, of HTDB being 0.43 and 0.98 eV, respectively. Sn-37Pb solder has a lamellar eutectic structure that can promote the diffusion-assisted climb of dislocations, resulting in lower H. Sn-3Ag-0.5Cu solder shows no HTDB in Q(-1) (T) curves since the formation of Cu6Sn5 and Ag3Sn intermetallics in the eutectic network band can impede dislocation motion. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：957 / 960

页数：4

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