Nanometre scale 3D nanomechanical imaging of semiconductor structures from few nm to sub-micrometre depths

被引:0
作者
Kolosov, O. V. [1 ]
DineIli, F. [2 ]
Robson, A. [1 ]
Krier, A. [1 ]
Hayne, M. [1 ]
Fal'ko, V. I.
Henini, M. [3 ]
机构
[1] Univ Lancaster, Dept Phys, Lancaster LA1 4YB, England
[2] CNR INO, Pisa, Italy
[3] Univ Nottingham, Sch Phys & Astron, Nottingham, England
来源
2015 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE AND 2015 IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE (IITC/MAM) | 2015年
基金
英国工程与自然科学研究理事会;
关键词
FORCE MICROSCOPY; SUBSURFACE;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:43 / 45
页数:3
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