High-rate dissolution of copper in cupric-sulfate electrolytes

被引：8

作者：

Vidal, R

West, AC

机构：

[1] Department of Chemical Engineering, Mat. Science, and Mining Engineering, Columbia University, New York

来源：

ELECTROCHIMICA ACTA | 1996年 / 41卷 / 15期

关键词：

salt film; EHD-impedance; AC-impedance; anodic dissolution; electroetching;

D O I：

10.1016/0013-4686(96)00022-9

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The mass-transfer-limited dissolution of copper in acidic and binary cupric-sulfate solutions is investigated. The dissolution produces a dull surface with a coarse microtexture. This system has an unusually large limiting-current plateau, where a salt film precipitates. The film is characterized with steady polarization measurements as well as AC-impedance and flow-modulation spectroscopy. A low-field, film-conduction mechanism explains best the high-frequency region of the AC-impedance spectrum. The electrochemical behavior of the system is compared to other high-rate metal-dissolution systems. Shortcomings of present salt-film models are discussed. Copyright (C) 1996 Elsevier Science Ltd

引用

页码：2417 / 2424

页数：8

共 22 条

[1]

ALKIRE R, 1984, J ELECTROCHEM SOC, V136, P913

[2] TRANSIENT MASS-TRANSFER AT A COATED ROTATING-DISK ELECTRODE - DIFFUSION AND ELECTROHYDRODYNAMIC IMPEDANCES [J].